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DATA SHEET
PHOTOCOUPLER
PS9113
1 Mbps, OPEN COLLECTOR OUTPUT HIGH CMR, INTELLIGENT POWER MODULE 5-PIN SOP PHOTOCOUPLER
-NEPOC Series-
DESCRIPTION
The PS9113 is an optically coupled isolator containing a GaAlAs LED on the input side and a photo diode and a signal processing circuit on the output side on one chip. The PS9113 is specified high CMR, high CTR and pulse width distortion with operating temperature. It is suitable for IPM drive.
FEATURES
* High instantaneous common mode rejection voltage (CMH, CML = 15 kV/s MIN.) * Small package (5-pin SOP) * High-speed response (tPHL = 500 ns MAX., tPLH = 750 ns MAX.) * Maximum propagation delays (tPLH - tPHL = 270 ns TYP.) * Pulse width distortion ( tPHL - tPLH = 270 ns TYP.) * Ordering number of taping product: PS9113-F3, F4: 2 500 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422 * DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option)
1 2
PIN CONNECTION (Top View)
5 4 3 1. Anode 2. Cathode 3. GND 4. VO 5. VCC
APPLICATIONS
* IPM Driver * General purpose inverter
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information.
Document No. PN10265EJ02V0DS (2nd edition) Date Published February 2005 CP(K) Printed in Japan
The mark
shows major revised points. (c) NEC Compound Semiconductor Devices, Ltd. 2003, 2005
PS9113
PACKAGE DIMENSIONS (UNIT: mm)
3.4 +0.3 -0.1
7.00.3 4.4
2.60.2
0.15 +0.10 -0.05
0.10.1
1.27 0.4 +0.10 -0.05 0.25 M
0.50.3
FUNCTIONAL DIAGRAM
5 1 4
2 3
Shield
LED ON OFF
Output L H
2
Data Sheet PN10265EJ02V0DS
PS9113
MARKING EXAMPLE
9113 N234
No. 1 pin Mark Initial of NEC (Engraved mark)
N
Assembly Lot *1
N
2 34
Week Assembled Year Assembled (Last 1 Digit) Rank Code
*1
Bar : Pb-Free
Data Sheet PN10265EJ02V0DS
3
PS9113
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number PS9113 PS9113-F3 PS9113-F4 PS9113-V PS9113-V-F3 PS9113-V-F4 PS9113-A PS9113-F3-A PS9113-F4-A PS9113-V-A PS9113-V-F3-A PS9113-V-F4-A Magazine case 100 pcs Embossed Tape 2 500 pcs/reel DIN EN60747-5-2 (VDE0884 Part2) Approved (Option) Pb-Free
*2 *1
Magazine case 100 pcs Embossed Tape 2500 pcs/reel
Standard products (UL approved)
PS9113
*1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Diode Forward Current
*1
Symbol IF VR VCC VO IO
*2
Ratings 25 5 -0.5 to +35 -0.5 to +35 15 100 2 500 -40 to +100 -55 to +125
Unit mA V V V mA mW Vr.m.s. C C
Reverse Voltage
Detector
Supply Voltage Output Voltage Output Current Power Dissipation
PC BV TA Tstg
Isolation Voltage
*3
Operating Ambient Temperature Storage Temperature
*1 Reduced to 0.33 mA/C at TA = 70C or more. *2 Reduced to 1.9 mW/C at TA = 70C or more. *3 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter High Level Input Current Output Voltage Supply Voltage LED Off Voltage Symbol IFH VO VCC VF MIN. 10 0 4.5 0 TYP. MAX. 20 30 30 0.8 Unit mA V V V
4
Data Sheet PN10265EJ02V0DS
PS9113
ELECTRICAL CHARACTERISTICS (TA = -40 to +100C, VCC = 15 V, unless otherwise specified)
Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Detector Low Level Output Voltage High Level Output Current High Level Supply Current Low Level Supply Current Coupled Threshold Input Current (H L) Current Transfer Ratio (IC/IF) Isolation Resistance CTR RI-O IF = 10 mA, VO = 0.6 V VI-O = 1 kVDC, RH = 40 to 60%, TA = 25C Isolation Capacitance Propagation Delay Time (H L)
*2
Symbol VF IR Ct VOL IOH ICCH ICCL IFHL IF = 10 mA VR = 3 V
Conditions
MIN. 1.3
TYP.
*1
MAX. 2.1 200
Unit V
1.65
A
pF
V = 0 V, f = 1 MHz, TA = 25C IF = 10 mA, IOL = 2.4 mA VCC = VO = 30 V, VF = 0.8 V VCC = 30 V, VF = 0.8 V, VO = open VCC = 30 V, IF = 10 mA, VO = open VO = 0.8 V, IO = 0.75 mA
30 0.13 0.01 0.6 0.6 1.5 0.6 50 1.3 1.3 5.0
V
A
mA mA mA
44 10
11
110
%
CI-O tPHL
V = 0 V, f = 1 MHz, TA = 25C IF = 10 mA, RL = 20 k, CL = 100 pF, VTHHL = 1.5 V, VTHLH = 2.0 V
0.6 250 500
pF ns
Propagation Delay Time (L H)
*2
tPLH -200
520
750
Maximum Propagation Delays Pulse Width Distortion (PWD)
*2
tPLH-tPHL
270
650
tPHL-tPLH
270
650
Common Mode Transient Immunity at High Level Output
*3
CMH
TA = 25C, IF = 0 mA, VO > 3.0 V, VCM = 1.5 kV, RL = 20 k, CL = 100 pF
15
kV/s
Common Mode Transient Immunity at Low Level Output
*3
CML
TA = 25C, IF = 10 mA, VO < 1.0 V, VCM = 1.5 kV, RL = 20 k, CL = 100 pF
15
kV/s
Data Sheet PN10265EJ02V0DS
5
PS9113
*1 Typical values at TA = 25C. *2 Test circuit for propagation delay time
Pulse input (IF = 10 mA) (PW = 10 s, Duty cycle = 1/10) Input (Monitor) 0.1 F VCC = 15 V RL = 20 k VO (Monitor) CL = 100 pF VTHHL = 1.5 V tPHL tPLH VOL Input IF (ON) 50% IF (ON) 15 V Output VTHLH = 2.0 V 47
CL includes probe and stray wiring capacitance.
*3 Test circuit for common mode transient immunity
VCM 90%
SW IF 0.1 F B A VCC = 15 V RL = 20 k VO (Monitor) CL = 100 pF
1.5 kV 0V
tr
tf
10%
VO (Switch A: IF = 0 mA) VO (Switch B: IF = 10 mA)
15 V 3.0 V 1.0 V VOL
VCM
CL includes probe and stray wiring capacitance.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity.
6
Data Sheet PN10265EJ02V0DS
PS9113
TYPICAL CHARACTERISTICS (TA = 25C unless otherwise specified)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
40 Detector Power Dissipation PC (mW) Maximum Forward Current IF (mA) 150
DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE
30
100
20
50
10
0
20
40
60
80
100
0
20
40
60
80
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD CURRENT vs. FORWARD VOLTAGE
100 High Level Supply Current ICCH (A), Low Level Supply Current ICCL (A) 1 200 1 000 800
SUPPLY CURRENT vs. AMBIENT TEMPERATURE
VCC = 30 V, VO = Open, ICCH : VF = 0.8 V, ICCL : IF = 10 mA ICCL 600 400 200 0 -50 ICCH
Forward Current IF (mA)
10 TA = +85C +50C +25C 0C -25C
1
0.1
0.01 1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
-25
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (C)
THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE
5 Threshold Input Current IFHL (mA) Low Level Output Voltage VOL (V) VCC = 15 V, VO = 0.8 V, IO = 0.75 mA 0.6 0.5 0.4 0.3 0.2 0.1
LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE
VCC = 15 V, IF = 10 mA, IO = 2.4 mA
4
3
2
1
0 -50
-25
0
25
50
75
100
0 -50
-25
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10265EJ02V0DS
7
PS9113
OUTPUT CURRENT vs. AMBIENT TEMPERATURE
1.10
OUTPUT CURRENT vs. FORWARD CURRENT
14 VO = 0.6 V 12
Output Current (Relative Value)
IF = 10 mA, 1.05 VO = 0.6 V 1.00 0.95 0.90 0.85 0.80 0.75 0.70 -40 -20 0 20 40 60 80 100
Output Current IO (mA)
10 TA = +25C 8 6 4 2 0 0 5 10 15 20 +100C -40C
Forward Current IF (mA)
Ambient Temperature TA (C)
Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH - tPHL (ns)
Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH - tPHL (ns)
PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. FORWARD CURRENT
700 VCC = 15 V, 600 CL = 100 pF, RL = 20 k 500 tPLH 400 300 200 100 0 0 5 10 15 20 tPHL
PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. SUPPLY VOLTAGE
1 800 1 600 1 400 1 200 1 000 800 600 400 200 0 -200 0 10 tPLH tPHL tPLH - tPHL 20 30 40 IF = 10 mA, CL = 100 pF, RL = 20 k
tPLH - tPHL
Forward Current IF (mA)
Supply Voltage VCC (V)
PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE
Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion tPHL - tPLH (ns) Propagation Delay Time tPHL, tPLH (ns)
700 600 500 400 300 200 100 0 -40 -20 0 20 40 tPHL tPLH 1 600
PROPAGATION DELAY TIME vs. LOAD CAPACITANCE
IF = 10 mA, 1 400 VCC = 15 V, RL = 20 k 1 200 1 000 800 600 400 200 0 0 100 200 300 400 500 tPHL
tPLH
PWD
IF = 10 mA, VCC = 15 V, CL = 100 pF, RL = 20 k 60 80 100
Ambient Temperature TA (C)
Load Capacitance CL (pF)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PN10265EJ02V0DS
PS9113
PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. LOAD RESISTANCE
IF = 10 mA, VCC = 15 V, 800 CL = 100 pF 600 tPLH - tPHL 400 tPHL 200 0 -200 0 tPLH
Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH - tPHL (ns)
Propagation Delay Time tPHL, tPLH (ns), Maximum Propagation Delays tPLH - tPHL (ns)
PROPAGATION DELAY TIME, MAXIMUM PROPAGATION DELAYS vs. LOAD RESISTANCE
500 IF = 10 mA, 450 VCC = 5 V, 400 CL = 15 pF 350 300 250 200 150 100 50 0 0 5 10 15 20 25 tPHL tPLH - tPHL tPLH
1 000
10
20
30
40
50
Load Resistance RL (k)
Load Resistance RL (k)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10265EJ02V0DS
9
PS9113
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.00.05 4.00.1
1.750.1
7.40.1
1.5+0.1 -0
3.45 MAX.
1.550.1
8.00.1
12.00.2
5.50.1
3.90.1
3.00.1
0.30.05
Tape Direction
PS9113-F3 PS9113-F4
Outline and Dimensions (Reel)
2.00.5
2.00.5
13.00.2
R 1.0
21.00.8
13.00.2
3302.0
1001.0
13.51.0
17.51.0
Packing: 2 500 pcs/reel
11.9 to 15.4 Outer edge of flange
10
Data Sheet PN10265EJ02V0DS
PS9113
NOTES ON HANDLING 1. Recommended soldering conditions
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s
260C MAX. 220C
to 60 s
180C
120C
12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C
Data Sheet PN10265EJ02V0DS
11
PS9113
(4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10265EJ02V0DS
PS9113
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
* The information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4 - 0110
Data Sheet PN10265EJ02V0DS
13
PS9113
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or i any way allow it to enter the mouth.
For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279
0406

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